Singleton, Roger (2012) Utilisation of chip thickness models in grinding. PhD thesis, University of Sheffield.
Temporary Embargo (access restricted until embargo expiry date) until June 2014.
Grinding is now a well established process utilised for both stock removal and finish applications. Although significant research is performed in this field, grinding still experiences problems with burn and high forces which can lead to poor quality components and damage to equipment. This generally occurs in grinding when the process deviates from its safe working conditions. In milling, chip thickness parameters are utilised to predict and maintain process outputs leading to improved control of the process. This thesis looks to further the knowledge of the relationship between chip thickness and the grinding process outputs to provide an increased predictive and maintenance modelling capability. Machining trials were undertaken using different chip thickness parameters to understand how these affect the process outputs. The chip thickness parameters were maintained at different grinding wheel diameters for a constant productivity process to determine the impact of chip thickness at a constant material removal rate. Additional testing using a modified pin on disc test rig was performed to provide further information on process variables. The different chip thickness parameters provide control of different process outputs in the grinding process. These relationships can be described using contact layer theory and heat flux partitioning. The contact layer is defined as the immediate layer beneath the contact arc at the wheel workpiece interface. The size of the layer governs the force experienced during the process. The rate of contact layer removal directly impacts the net power required from the system. It was also found that the specific grinding energy of a process is more dependent on the productivity of a grinding process rather than the value of chip thickness. Changes in chip thickness at constant material removal rate result in microscale changes in the rate of contact layer removal when compared to changes in process productivity. This is a significant piece of information in relation to specific grinding energy where conventional theory states it is primarily dependent on chip thickness.
|Item Type:||Thesis (PhD)|
|Keywords:||chip thickness, creep feed grinding,|
|Academic Units:||The University of Sheffield > Faculty of Engineering (Sheffield) > Mechanical Engineering (Sheffield)|
|Depositing User:||Mr Roger Singleton|
|Date Deposited:||09 Jul 2012 15:54|
|Last Modified:||08 Aug 2013 08:49|