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Copper Clad Laminate for High Frequency Printed-circuit Board in 5G era

Feng, Shuchang (2018) Copper Clad Laminate for High Frequency Printed-circuit Board in 5G era. MSc by research thesis, University of York.

Copper Clad Laminate for High Frequency Printed-circuit Board in 5G era.pdf - Examined Thesis (PDF)
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With the rapid development of the communication industry, the demand for hardware is constantly growing. However, traditional epoxy resin copper clad laminate (CCL) cannot meet the high frequency requirement of 5G (fifthgeneration wireless systems) environments. PTFE is an excellent dielectric material with a low dielectric constant and minimal dielectric loss. It can thus be widely used in mobile communication equipment, radio receivers, transfer devices, base station antennae, and household appliances, and CCL made from PTFE has many applications. The main purpose of this project was to investigate the use of PTFE to replace epoxy resin. There are several obvious problems with this, such as poor mechanical properties (bending strength, hardness, and so on), the large coefficient of thermal expansion, and the poor bonding force between the copper foil and matrix resin. Those problems greatly affect the promotion of this technique. To solve the issues with poor mechanical properties, this project investigated the use of different reinforcing materials such as glass fabrics and glass fibre mats while simultaneously seeking and testing a suitable silane coupling agent to increase the fibre strength and the binding forces between the resin and any reinforcing materials. Alongside investigating a silane coupling agent, this project also researched various copper foil and bonding layer, as these two things are the most important elements affecting bonding force and fulfilling the various purposes of CCL. Based on experiments and comparisons, electrolytic copper foil and FEP film were the technologies selected in this project. In order to explore the performance of copper foil and a bonding layer, this project utilised the process of hot-pressing and copper cladding. The coefficient of thermal expansion of PTFE is much larger than that of epoxy resin, as the hot-pressing of PTFE board and copper cladding cannot be done together. The pressure curve and temperature must thus normally be designed separately. In this project, an integrated technological approach was designed and tested.

Item Type: Thesis (MSc by research)
Academic Units: The University of York > Electronics (York)
Depositing User: Mr Shuchang Feng
Date Deposited: 04 Jun 2019 13:37
Last Modified: 04 Jun 2019 13:37
URI: http://etheses.whiterose.ac.uk/id/eprint/23994

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