Copper Clad Laminate for High Frequency Printed-circuit Board in 5G era

Feng, Shuchang (2018) Copper Clad Laminate for High Frequency Printed-circuit Board in 5G era. MSc by research thesis, University of York.

Abstract

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Awarding institution: University of York
Academic Units: The University of York > Electronics (York)
Depositing User: Mr Shuchang Feng
Date Deposited: 04 Jun 2019 13:37
Last Modified: 04 Jun 2019 13:37

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Filename: Copper Clad Laminate for High Frequency Printed-circuit Board in 5G era.pdf

Licence: Creative Commons Attribution Non-commercial No Derivatives (UK)

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