Copper Clad Laminate for High Frequency Printed-circuit Board in 5G era

Feng, Shuchang (2018) Copper Clad Laminate for High Frequency Printed-circuit Board in 5G era. MSc by research thesis, University of York.

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Supervisors: Xu, Yongbing
Awarding institution: University of York
Academic Units: The University of York > School of Physics, Engineering and Technology (York)
Academic unit: Electronic Engineering
Depositing User: Mr Shuchang Feng
Date Deposited: 04 Jun 2019 13:37
Last Modified: 21 Mar 2024 15:32
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